Sign In | Join Free | My himfr.com
Home > Electronic Potting Compound >

6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

    Buy cheap 6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound from wholesalers
     
    Buy cheap 6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound from wholesalers
    • Buy cheap 6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound from wholesalers

    6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

    Ask Lasest Price
    Brand Name : Huitian
    Model Number : 6202
    Price : Negotiation
    Payment Terms : L/C, T/T
    Supply Ability : 3000 KG MONTH
    Delivery Time : 8-15 DAYS
    • Product Details
    • Company Profile

    6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound

    6202 (HT6202T) double component heat curing epoxy potting adhesive is for Automobile ignition coil potting


    202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy adhesive. Low viscosity, easy penetration of defoaming, permeability is good, cracking resistance is good , insulating property good, high temperature resistant.


    Typical Applications

    Automobile ignition coil potting


    Characteristic before curing

    Representative value range

    A component

    Color Grey

    Density g/cm3(25℃) 1.85 1.82~1.88

    (GB/T13354-1992)

    Viscosity mpa.s(25℃)400000 300000~500000

    GB/T 2794-1995

    B component

    Color Yellow

    Density g/cm3(25℃) 1.15 1.10~1.20

    (GB/T13354-1992)

    Viscosity mpa.s(40℃) 60 40~70

    (GB/T 2794-1995)


    Characteristic after mixing

    Color Grey

    Weight ratio A:B =100:28

    Volume ratio A:B =100:44

    Operation time 130g GB/T 7123.1-2002) ≥75

    Condition of cure min(90℃,130g) 90℃@3h+130℃@3h


    Characteristic after curing

    Harness: Shore-D(GB/T 531-1999) 92

    Glass-transition temperature℃ 142

    GB/T 11998-1989

    Volume Resistivity Ω·cm(25℃) 1.0×1015

    GB/T1692-1992

    Dielectric Strength KV/mm(25℃)(GB/T1692-1992) ≥25

    Bending strength: Mpa 105

    shock strength KJ/m2,(GB/T 1843-2008) 2.7

    Shear strength Mpa(GB/T13930)≥7

    Dielectric constant(25℃,1.2MHz,GB/T1692-1992)3.8

    dielectric dissipation factor(25℃,1.2MHz) 0.012

    GB/T1692-1992

    Thermal conductivity W/m.K(25℃)(GB/T 11025-1989) 0.6

    water absorption %(ISO 62) <0.1

    Work Temperature℃ -40~150


    Direction for use

    1. 1 glue injection: 90 ~ 100 ℃ preheated A component 2~3 hour(make sure adhesive hot enough, viscosity is low),Stir evenly inhaled or into the vacuum tank with agitator (Semi automatic filling and sealing potting process must first accurate weighing A component and then poured into tank). 80 ~ 90 ℃ while stirring vacuum for 2 to 3 hours(to no bubbles),keep warm and waiting to use.

    A. semi automatic filling and sealing process: accurate weighing in component B, A:B =100:28,poured into which vacuum tank loaded accurately weighing A components,60 ~ 65 ℃ while stirring vacuum for 30 minutes,until no bubbles. Potting process begin, after potting Put in the oven to curing.

    B. Automatic filling and sealing process:poured B component into which vacuum tank loaded accurately weighing A components, 35 ~ 45 ℃ while stirring vacuum for 30 minutes. Then adjust the A component and the B component of the discharge ratio(Weight ratio A:B =100:28;Volume ratio A:B =100:44),after ratio adjust, start inject adhesive,keep the temperature 60~65℃.After adhesive injection, put in the oven to curing.

    2.Curing:put in 90℃ oven 3 hours, and slowly warming up to 130℃(warming up time keep in 30~40 minutes),curing in 130℃ 2.5~3 hours,after curing slowly cooling to 50℃, and take it out of oven(cooling time keep in 60 minutes).


    Attention

    Every time mix adhesive need keep in 5-10KGS,mixed adhesive should finish used in 1 hour. The Vacuum degree of vacuum tank and vacuum room should as low as possible.


    Packing

    41kg/Set

    A component 32kg/bucket. B component 9kg/bucket


    Storage

    Store it in dry and shady places at the temperature of 8~28℃.Storage life 12 months

    Quality 6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Shanghai Huitian New Material Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)